Introduction of PCB coating and surface treatment

1. Gold-plated board 

Gilded plate process cost is the highest of all plates, but all the existing plate one of the most stable, and the most suitable for use in the lead-free process sheet, especially in some high price or need high reliability electronic products have suggested using this board as a base material.

2, OSP board (OrganicSolderabilityPreservatives)

OSP process lowest cost, simple operation, but this process for shall assembly equipment and the process conditions and poor heavy sex so popularity is still poor, use this kind of plate, after high temperature heating, protective film would be destroyed in the process of the overlying on the PAD, and results in the decrease of solder sex, especially when the substrate is much more serious after secondary back after welding, so if the process also need to be on after a DIP process, the DIP side will face to the challenge of welding.

3. ImmersionAg

"Silver", although have very strong mobility itself, resulting in leakage occurs, but today's "immersion silver plating is not pure silver, but with organic matter in the plating silver" organic "therefore have been able to meet the future demand on lead-free process, its weldability of longer life expectancy than OSP printed circuit board assembly.

4. ElectrolessNi/Au, ENIG

The biggest problem with this type of substrate is the "BlackPad" problem, so there are a lot of big factories that don't agree to use it on lead-free processes, but most domestic manufacturers use it.

5. ImmersionTin

This kind of substrate is easy to be polluted and scraped, and the oxidation and discoloration of FLUX will occur. Most domestic manufacturers do not use this process, and the cost is relatively high.

6. Spray tin plate

Because of low cost, good soldering, good reliability and the best compatibility, the solder plate with good welding characteristics has lead, so no lead can be used.