Circuit board multi-pin dense pin IC removal method
Circuit board multi-pin dense pin IC removal method ● Hollow needle removal method. Take several medical needles numbered 8 to 12 hollow. When the PCBA copy board is used, the internal spring of the needle just fits the pins of the manifold. When disassembling, melt the pin solder with a soldering iron, timely cover the pin with a needle, then remove the soldering iron and rotate the pin, and wait until the solder solidifies and pull out the pin. This completely separates the pin from the printed board. Once all pins have been used for this purpose, the manifold can easily be removed. ● Suction tin removal method. The use of tin remover to disassemble the integrated block, which is a common professional method, the use of tools for ordinary suction, welding dual-use electric iron, power above 35W. When disassembling the integrated block, as long as the heated dual-purpose electric iron head is placed on the pin of the integrated block to be disassembled, the tin to be soldered is melted and then sucked into the fine tin device. After the solder of all the pins is sucked, the integrated block is Can be removed. ● Electric iron brush with disassembly method. This method is simple and easy, as long as there is a soldering iron and a small brush. When disassembling the integrated block, the electric iron is heated first, and after the tin melting temperature is melted on the lead, the melting brush is used to sweep away the melted solder. This allows the pins of the manifold to be separated from the printed board. This method can be divided or performed in separate ways. Finally, use a sharp tweezers or a small “1” screwdriver to pry down the manifold. ●Multi-strand copper wire removal method. It is to use multiple strands of copper core plastic wire to remove the plastic sheath and use multiple strands of copper core wire (short heads can be used). Before use, the rosin alcohol solution on the stranded copper core wire is used. After the iron is heated, the stranded copper core filaments are placed on the leads of the manifold block to be heated, so that the solder on the pins is adsorbed by the copper filaments. The upper part of the solder can be cut, and the solder on the pin can be completely removed by repeating the soldering several times. It is also possible to use the braided wire inside the shielded wire. As long as the solder is sucked, use a tweezers or a small "1" screwdriver to gently remove the chip. ● add solder melt disassembly method. This method is a convenient method. PCBA OEM OEMs only need to add some solder to the pins of the manifold to be disassembled, so that the solder joints of each row of pins can be connected. This facilitates heat transfer and is easy to disassemble. When disassembling, use a soldering iron to heat a column of pins and use a pointed tweezers or a small "1" screwdriver to rake them. Heat the two pins alternately until they are removed. Under normal circumstances, each column of pins can be removed by heating twice.