The reason why the board is not easy to tin

Circuit board production is a complex process that, as the motherboard of a product, always bears more or less risk and responsibility. In particular, the circuit board is in the process of testing whether the contact between the motherboard and the component is in good condition. If not paid attention, the whole product may work poorly or even fail to work.

    The circuit board should be dust-free throughout the production process, especially during exposure, etching, subsequent tinning, immersion gold, testing, and packaging. It must be dust-free to prevent debris from reaching the solder paste or pads. , affecting welding. These procedures will be specially strengthened by our company to ensure zero complaints and feedback for the ultimate purpose. Manually during the testing process, care should be taken to ensure that there is no perspiration on the hands, and gloves should be used as much as possible. The patch assembly personnel should also pay attention to the cleaning of the solder pads before soldering. If the pads are very precise, When the requirements are particularly strict. As for the Shenjin circuit board, special attention should be paid to the oxidation of the outside air and the oxidation of the sweat. The immersion gold circuit board is easy to be oxidized. The soldering manufacturers and customers should try to ensure that the circuit board manufacturer's factory packaging is complete before the patch is prepared. Remove the vacuum packaging, otherwise the patch will cause difficulties after oxidation.

    The tin-plated circuit board should pay attention to ensure that the tin surface is clean and tidy. Pay special attention to ensure that the tin surface is flat. There will be water stains in the tin spray. It is caused by the cleaning of the tin surface, which should be reworked. The unevenness of the tin surface should be caused by improper operation during the tin spraying process and should be adjusted in time. SMT chip manufacturers should pay attention to cleaning the tin surface before soldering. The precision pad should ensure the tin is full when soldering. It is necessary to add flux soldering. Generally, environmentally friendly products are required now, so the factory is lead-free tin. Lead-free soldering of the circuit board may cause soldering difficulties. When soldering, an appropriate flux may be added to help the solder pad of the circuit board pad saturate.

    If the gold-plated board is found to have slight oxidation before soldering, it should be wiped with alcohol and then soldered. Generally, there is not much problem.