Surface mount related package characteristic identifier

PCBA surface mount related package characteristic identifier

E Increase the spacing (>1.27 mm).

F Fine pitch (<0.5 mm); limited to QFP components.

S Shrink spacing (<0.65 mm); all components except QFP.

T slim (1.0 mm body thickness).

A simple list of surface mount identifiers for terminal locations includes:

Dual pins are on opposite sides of a square or rectangular package.

Quad pins are on four sides of a square or rectangular package.

A simple list of surface mount packaging type identifiers includes:

CC chip carrier package structure.

FP flat pack package structure.

GA grid array package structure.

SO small outline package structure.

A simple list of surface mount pin configuration identifiers includes:

B. A straight shank or ball pin structure; this is a non-compliant pin form

F A straight pin structure; this is a non-compliant pin form

G A fin-shaped lead structure; this is a compliant pin form

J A "J" bent pin structure; this is a compliant pin form

N A pinless structure; this is a non-compliant pin form

S An "S" shaped pin structure; this is a compliant pin form

For example, the acronym F-PQFP-G208 describes a 0.5 mm (F) plastic (P) square (Q) planar package (FP), a fin-shaped pin (G), and a terminal number 208.

Detailed tolerance analysis of component and board surface features (ie pad structures, fiducials, etc.) is necessary. The PCB board IPC-SM-782 explains how to perform this analysis. Many components (especially fine-pitch components) are designed in strictly metric units. Do not design imperial pad structures for metric components. Accumulated structural errors produce mismatch and cannot be used at all for fine-pitch components. Remember that 0.65mm equals 0.0256" and 0.5mm equals 0.0197".