1. Adopt surface mount technology (SMT);
2. Perform extremely effective processing of thermal diffusion in circuit design schemes;
3. Reduce product operating temperature, improve product power density and reliability, and extend product life;
4. Reduce product volume, reduce hardware and assembly costs;
5. Replace brittle ceramic substrates for better mechanical durability.
Contact: Lillian Zhu
Phone: 008613928048496
Tel: 0755-28628518
Email: leappcb@163.com,sales@leappcb.com
Add: Hongtian industry,baoan area,shenzhen city,guangdong ,china