BGA is the ball grid array, is used for integrated circuit of a surface-mount package chip. The BGA chip is used to permanently install devices such as microprocessors. BGA can provide more interconnect pins than can be placed on a dual in-line or flat package. You can use the entire bottom of the device, not just the perimeter. The average lead time is shorter than the peripheral type, so that high-speed operation, you can achieve better performance.
printed circuit board assembly BGA devices need precise control of welding, usually through the automation process to complete. BGA devices are not suitable for socket installation.
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