The assembly density is high, the size of the electronic product is small, and the weight is light. The volume and weight of the chip components are only about 1/10 of that of the conventional plug-in components. After the SMT is generally used, the volume of the electronic product is reduced by 40% to 60%, and the weight is reduced by 60%. 80%.
High reliability and strong anti-vibration ability. The solder joint defect rate is low.
High frequency characteristics are good. Reduced electromagnetic and radio frequency interference.
Easy to automate and increase productivity. Reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc.
Contact: Lillian Zhu
Add: Hongtian industry,baoan area,shenzhen city,guangdong ,china