PCBA component abbreviations

1, BGA

The abbreviation of Ball Grid Array, which can be translated into a ball grid array package, whose soldering ends are solder balls and arranged in an array at the bottom of the package. The ball grid array package includes a full array and a peripheral array. The standard ball center distance is 1.50 mm. 1.00 mm, 0.80 mm, 0.65 mm, 0.50 mm, 0.40 mm, and 0.35 mm.

2, BTC

That is, the abbreviation of Bottom Termination Component, which can be translated into the bottom end package, the soldering end is flat and the bottom surface of the package is BTC type package including QFN, LGA, SON, DFN, MLFP, MLP and other package forms.

3, QFN

The abbreviation of Quad Flat No-Lead-Package, which can be translated into a square flat leadless package, the solder ends are flat and placed on the four sides of the bottom surface of the package.

4, LGA

The abbreviation of Land Grid Array, which can be translated into a pad grid array package, whose solder ends are flat and arranged in an array at the bottom of the package.

5, SON

That is, the abbreviation of Small Outline No--ead, which can be translated into a small-profile leadless package, whose soldering ends are flat and laid on both sides of the bottom of the package.

6, MLP

That is, the abbreviation of Micro Leadframe Package can be translated into micro-lead frame package. The soldering end is flat and arranged on the four sides of the bottom surface of the package, which can be understood as a small-sized QFN.