Basic knowledge of PCBA surface mount technology

Characteristics of SMT

High density assembly, electronic products, small volume, light weight, the volume and weight of the patch element is only about 1/10 of the traditional instrumentation component, generally USES the SMT, electronic products smaller 40% ~ 60%, 60% ~ 80% reduction in weight.

High reliability and strong vibration resistance.Low weld defect rate.

High frequency characteristics.Reduced electromagnetic and rf interference.

Easy to realize automation, improve production efficiency.Reduce the cost by 30%~50%.Save materials, energy, equipment, manpower, time, etc.

Why should I use PCBA surface mount technology (SMT)?

Electronic products pursue miniaturization, the previously used perforated plug-in components cannot be reduced.

The electronic products are more complete, and the integrated circuit (IC) has no perforated components, especially large scale and high integrated IC.

Product approval, production automation, the factory to low cost high yield, produce quality products to meet customer demand and enhance market competitiveness.

The development of electronic components, the development of integrated circuits (IC), multivariate applications of semiconductor materials.

The revolution of electronic science and technology is imperative, pursue international tide.

Why should I use PCBA surface mount technology (SMT)?

Electronic products pursue miniaturization, the previously used perforated plug-in components cannot be reduced.

The electronic products are more complete, and the integrated circuit (IC) has no perforated components, especially large scale and high integrated IC.

Product approval, production automation, the factory to low cost high yield, produce quality products to meet customer demand and enhance market competitiveness.

The development of electronic components, the development of integrated circuits (IC), multivariate applications of semiconductor materials.

The revolution of electronic science and technology is imperative, pursue international tide.

Why do you apply the free cleaning process in PCBA surface mount technology?

In the process of production, the waste water from the back of the product can bring water quality, the earth and the pollution of plants and animals.

In addition to water cleaning, organic solvents containing chlorofluorocarbons (CFC&HCFC) are used for cleaning, as well as pollution and destruction of air and atmosphere.

The residue of cleaning agent can cause corrosion on the board, which seriously affects the quality of products.

Reduce cleaning operation and maintenance cost.

No cleaning can reduce the damage caused by PCBA in the process of movement and cleaning.Some of the components remain unwashed.

The flux residues have been controlled and can be used to match the appearance of the product to avoid visual inspection of the cleaning status.

Residual flux has continuously improved its electrical properties to avoid leakage of the finished product, resulting in any damage.

The no-wash process has passed international safety tests to prove that the chemicals in the flux are stable and non-corrosive.