Welcome: Shenzhen leap electronic co.,ltd
Language:
∷
∷
∷
Generally, the lead-free solder joint reliability test methods are as follows:
1. Mechanical vibration test
2, mechanical impact test
3, temperature shock test
4, high acceleration aging test
5, temperature and humidity test
6, etc.
Contact: Lillian Zhu
Phone: 008613928048496
Tel: 0755-28628518
Email: leappcb@163.com,sales@leappcb.com
Add: Hongtian industry,baoan area,shenzhen city,guangdong ,china
Lillian
leappcb