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What are the reliability test methods for PCBA lead-free solder joints

Generally, the lead-free solder joint reliability test methods are as follows:

1. Mechanical vibration test

2, mechanical impact test

3, temperature shock test

4, high acceleration aging test

5, temperature and humidity test

6, etc.


Contact: Lillian Zhu

Phone: 008613928048496

Tel: 0755-28628518

Email: leappcb@163.com,sales@leappcb.com

Add: Hongtian industry,baoan area,shenzhen city,guangdong ,china

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