PCB inspection specification

1. Line part:

1, disconnect,

A, there is fracture or discontinuity on the line,

B, the length of line break length is more than 10mm and cannot be repaired.

C, the broken line is located near the PAD or the hole edge, (the broken path is less than or equal to 2mm maintenance. The broken path is more than 2mm from PAD or hole edge, and cannot be repaired.)

D, the adjacent lines are disconnected and disconnected.

E, the line gap is broken at the turning point. (less than or equal to 2mm at the bottom of the road, it can be serviced. The bend at the break is more than 2mm, which cannot be repaired.)

2, short circuit,

A, there is A foreign matter between the two lines that causes short circuit and can be repaired.

B, inner - layer short circuit is not serviced.

3. Line gap,

A, the line gap is 20% less than the original line and can be maintained.

4. Line sag & indentation,

A, the line is uneven and the line is pressed down to be serviced.

5. The line is tin-stained.

A. The area of tin is less than or equal to 30 mm2, which can be repaired. The area of tin is greater than 30 mm2.

6. Faulty line repair,

A, patch deviation or filling line size is not in line with the original line size (if the minimum width or spacing is not affected)

7. The wiring of copper,

A, the welding of the line is off and can be repaired

8, the line is crooked,

A, the spacing is smaller than the original space or has A concave opening, which can be repaired

9. Line stripping,

A, there is A stripping phenomenon between the copper layer and the copper layer and cannot be repaired.

10. Insufficient line spacing,

A, the reduction of the spacing between the two lines cannot be more than 30%.

11, the residual copper,

A, the reduction of the spacing between the two lines shall not exceed 30%.

B, the two lines are reduced by more than 30%.

12. Line pollution and oxidation,

A, the lines are discolored, dimmed and unserviced due to oxidation or pollution.

13. Line scratches,

A, the line is caused by A scratch that causes the copper to be serviced, and the absence of copper is not to be regarded as scraping.

14, thin,

A, the line width is less than 20% of the specified line width.@ # $%

2. Anti-welding part:

1. Color difference (standard: upper and lower levels),

A, the color of the board ink is different from the standard color. The color difference table can be used to determine whether it is acceptable

2. Anti-welding cavitation;

3. Anti-weld copper;

A, green paint stripped of copper for maintenance.

4. Anti-weld scratch;

A, the weld damage caused the copper or the bottom material, can be repaired

5. Anti-welding ON PAD,

A, part tin PAD& BGA PAD&ICT PAD ink, unmaintainable.

6. Bad repair: the area of green paint coating is too large or incomplete, the length is greater than 30mm, the area is larger than 10mm2 and the diameter is greater than 7mm2.Do not accept.

7. Having foreign body;

A, there are other foreign matter in the welding layer.

8 ink irregularity;

A, the surface has accumulated ink or, uneven and influence the appearance, local slight inks do not need to be repaired.

9.BGA VIAHOL unplug ink;

A, BGA requires 100% of the inks,

10.CARD BUS VIA HOLE unpacked ink

A, the VIAHOLE at CARD BUS CONNECTOR needs to be 100% perforated. The inspection method is not transparent under the backlight.

11.VIA HOLE;

A, the VIA HOLE needs 95% cold, and the HOLE test method is not transparent under the backlight

12. Touch tin: no more than 30mm2

13. Artificial copper;Maintainable string 5

14. Ink color error;Please do not duplicate the contents of this site

3. Perforation part;

1, plug,

A, the hole in the part of the parts causes the hole of the parts to be unserviced.

2, the hole broken,

A, the hole in the ring holes can't be repaired.

B, punctate holes cannot be repaired.

3. Green paint in parts orifice,

A, the parts are covered with anti-welding paint, white paint residue and unmaintainable

4, NPTH, tin in the hole

A, NPTH hole is made into PHT hole for maintenance.

5. The hole is locked and unmaintainable

6. Hole leakage lock, cannot be repaired.

7. Hole deviation, hole bias out PAD, unmaintainable.

8. Hole big, small hole,

A, the hole large hole is smaller than the specification error value. Unmaintainable.

9. The VIA HOLE plug of BGA, cannot be repaired.

Iv. Text part:

1. Text offset, text offset, overpainting to tin pad. Unmaintainable.

2. The text color is not in accordance with the color of the text.

3. Text heavy shadow, text heavy shadow can be identified, can be repaired,

4. The text leakage, the word leak cannot be repaired.

5. Writing ink stain board, ink stain surface, maintenance,

6. The text is unclear, the text is not clear, the influence is identified. Can be repaired.

7. The text falls off, and there are 3M600 tape for tension test. The text falls off and can be repaired.

5. PAD part:

1. Tin pad gap, tin cushion caused by scratches or other factors to create a gap, can be repaired,

2. BGA PAD gap, the BGA part of tin PAD has a gap, cannot be repaired,

3. The optical point is not good, the optical point is sprayed with tin-edge, uneven, and the coating can not be opposite or to the position, causing the deviation of the parts to be unserviced.

4. The BGA spray tin is uneven, the spray tin thickness is too thick, and the pressure of the external pressure causes the tin to be flat and unmaintainable.

5. Optical point loss and unmaintainable optical point,

6. PAD comes off and PAD comes off to repair.

7. The QFP does not fall into ink and cannot be repaired.

8. The QFP will fall off under the ink, and the QFP will fall within 3 pieces of ink. Otherwise, it will not be repaired.

9. Oxidation, PAD is contaminated and discolored, can be repaired,

10. PAD lu copper, if BGA or QFP PAD copper, unmaintainable,

11. PAD with white paint or anti-welding ink, PAD with white paint or ink cover, can be repaired.

Vi. Other parts:

1. Separation of PCB sandwich, white spot, white spot, unmaintainable,

2. The weave reveals that there are woven glass fabric marks, which are greater than or equal to 10mm2, which cannot be repaired.

3. Surface pollution, the surface must not have gray pressure, handprint, oil stains, rosin, glue residue, or other foreign pollution, can be repaired,

4. The size of the molding is too large, and the external dimension tolerance exceeds the standard of admission.

5. Cut and cut, incomplete and unmaintainable,

6. Plate thickness, thin plate and thick sheet, super PCB production specification, unmaintainable,

7, the board become warped, board Chou height is greater than 1.6 mm, not repair.

8. Forming the edge of the moulding, forming the rough edges, the edges of the plates are not flat, and can be serviced